SPICE modeling requires collecting relevant electrical characteristics and physical parameters of the target devices based on wafer testing. Engineers need to choose or customize the appropriate SPICE model according to the application scenario and requirements. The model describes the basic physical behavior of devices, such as voltage, current, resistance, and capacitance, as well as other nonlinear characteristics, using complex mathematical equations. Model parameters are then extracted using experimental or simulation data and specialized EDA tools. Engineers then repeatedly optimize the model parameters to ensure that the simulation results are as close as possible to the actual silicon data.
Primarius modeling service team has over 10 years of experience in providing outsourcing services to the world's leading wafer foundries. We’re committed to offering efficient and professional modeling services, covering a wide range of process technologies from 0.35 microns to 7 nanometers. With leading technology and a professional spirit, we provide our customers with comprehensive, high-quality modeling services. And the services are widely used in logic, analog, memory and RF chip design and manufacturing.